Crystal Processing tools

The diamond wheel saw is useful for cutting the single-crystals. The speed and job thickness can be controlled.

The compact diamond single-wire saw machine is used for cutting (cropping, shaping and dicing) hard and brittle materials like Silicon, Sapphire, SiC, organic, semi-organic and inorganic crystals and other ceramics, etc.  

Multi-wire saw machine can be used to cut into thin multiple wafers. Cutting materials like Silicon, Sapphire, SiC and etc. 

Lapping and Polishing machines are used to grind and polish crystals to achieve a flat and smooth surface.