Crystal Process Equipment

The diamond wheel saw is an essential tool among crystal processing tools, particularly effective for cutting single-crystals. With this tool, the speed and job thickness can be precisely controlled, making it a valuable addition alongside other equipment like the multi-wire saw machine.

The compact diamond single-wire saw machine serves as an essential tool in crystal processing, particularly for cutting (cropping, shaping, and dicing) hard and brittle materials such as Silicon, Sapphire, SiC, organic, semi-organic and inorganic crystals, as well as various ceramics. This machine complements the use of diamond wheel saws and is part of the broader category of multi-wire saw machines.

The multi-wire saw machine is an essential tool in crystal processing, capable of cutting materials like Silicon, Sapphire, and SiC into thin multiple wafers. This advanced technology utilizes a diamond wheel saw for precision and efficiency in the cutting process.

Lapping and polishing machines, along with other crystal processing tools, are utilized to grind and polish crystals, ensuring they achieve a flat and smooth surface. Additionally, these processes can be enhanced using a diamond wheel saw or a multi-wire saw machine.